Denis Joseph Nexum Hardware.

Circuit Board

This is a general guide to good practice PCB Board rules design (PCB) for high frequency or frequencies radio frequency (RF) circuit. Following these rules will help you avoid some common pitfalls in RF design. Poor layout of PCB is one of the most common causes of failure to transmit or receive EMC performance and failures due to spurious emissions. Ideally an engineer to undertake a PCB design should be familiar with IPC standards as they provide a rich source of information and best practices on general principles for design of PCBs.

When planning the layout of an RF card, the first thing to do is contact your favorite card manufacturer and obtain a set of guidelines and their production capacities. This will include the minimum track widths and the gap, sizes of drilling and other key parameters. The manufacturer of the card must also be able to provide you with their standard layer stack and the data material, this will include the weight of copper, dielectric constant and thickness of the base layers and prepreg in multilayer boards. At unless your circuit is very simple I propose a commission of 4 layers is used, it provides a continuous ground plane. When you use a card Double-sided, it is very difficult to ensure that the ground plane is not broken. Another advantage of a 4 layer board is that the dimensions of micro-strip for a 50 or 75 ohm design are easier to manage. Use a calculator to determine micro-strip width required to track the impedance design and ensure it is within the factory building, otherwise you may need to discuss the layer-stack with the manufacturer and select a non-standard build. Another point to note is that, in my experience trying to hold the nets cause beyond the zone is generally different signal causes of problems rather than any advantage and is largely a return to the days before the multilayer boards, single ground plane impedance is low road safest.

It is perfectly acceptable to use FR4 boards up to 2.4 GHz less than the highest level of performance is necessary. In some circumstances, it is worth noting that the board impedance controlled to provide consistent RF performance.

After have determined the geometries and edge of the runway next step is to treat the placement of components. Ensure that RF components are arranged so that all RF paths can be maintained on the upper surface of a minimum length and direction changes. Start with areas of low level signal to the antenna or RF input and work backwards to the baseband or digital domain. Maintain areas of digital and food away from analog RF circuits and retain all RF components on one side of the board.

When your songs RF can not be run in a straight line, use your miter bends if CAD system supports them, never use your elbows at right angles to the signal lines RF. If the tab turns are not supported using a series of bends 45 degrees or arcs, which reduces impedance faults which would increase the losses and spurious.

On RF shots, it is common to provide a flood of soil on the top layer and "Paste" the ground plane using multiple VIA. If you intend to do, make sure the copper is maintained at an appropriate distance from the railway and RF impedance contrast will be lowered and cause more harm than good. Via spacing may be 5-10mm apart, there is very little benefit sewing through the course less than 5 mm apart.

Ground slopes from RF components should be as short as possible and use 2 or 3 via parallel by minimizing impedance.

Nigel Gaylard is Technical Director of TrimeriX Limited who are RF consultants, offering RF Design and development. TrimeriX are based in High Wycombe, UK.

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